Wheel for the laboratory of notch cut
Bond having high minimization, wear resistance and abrasive retentivity of the processing damage is adopted by abrasive laminar structure minute uniformly.
I achieve extension of life in high shape maintenance characteristics.
It is supported various wafer shapes by high-precision sulcular profiling, finish processing technique.
It is targeted for processing
Silicon wafers
Diamond layer shape type
Specifications and dimensions
Abrasive
| Particle size
| Intensive degree
| Combination materials
| The example which is targeted for processing
|
SD
| ＃800
...
♯2000
| 75
...
150
| MNK018
| Silicon, SiC, sapphire
|
MNK016
| Silicon, SiC, sapphire
|
※An available combination varies according to bond.
I may cope as well as the above. Specifically, please refer until our business.
I may change this catalogue without a notice.
