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Wheel for the laboratory of notch cut

Bond having high minimization, wear resistance and abrasive retentivity of the processing damage is adopted by abrasive laminar structure minute uniformly.
I achieve extension of life in high shape maintenance characteristics.
It is supported various wafer shapes by high-precision sulcular profiling, finish processing technique.

It is targeted for processing

Silicon wafers

Diamond layer shape type

Specifications and dimensions

Abrasive
Particle size
Intensive degree
Combination materials
The example which is targeted for processing
SD
#800
...
♯2000
75
...
150
MNK018
Silicon, SiC, sapphire
MNK016
Silicon, SiC, sapphire
※An available combination varies according to bond.
 I may cope as well as the above. Specifically, please refer until our business.
 I may change this catalogue without a notice.
ADAMAS
〒959-2477
1117-384, Shimokonakayama, Shibata-shi, Niigata
TEL. 0254-33-2211
FAX. 0254-33-3756
Production, sale of the Diamond whetstone
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