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Chamfering Wheel

It is a whetstone for the chamfering processing of the silicon wafer. I adopt metal bond to a binder and it is highly precise and realizes high efficiency processing. I cope with various specifications such as various shapes, a single groove and consecutive grooves, a fault, a finish one model.

Specifications and dimensions

Standard specifications

Abrasive
Particle size
Intensive degree
Combination materials (bond)
Standard
Durability serious consideration
SD
#400
...
♯2000
75
...
125
MNK016
MNK018

Stock size

Outer diameter
Diamond layer width
Diamond layer thickness
Groove
102mm
...
202mm
3mm
...
5mm
3mm
...
15mm
1 
...
10 grooves

Processing example

Particle size
Wheel circumferential speed
Aspect coarseness (Ra)
#800
2500m/min
0.3μm
#1500
2500m/min
0.15μm

Diamond layer shape type

       
     
※An available combination varies according to bond.
 I may cope as well as the above. Specifically, please refer until our business.
 I may change this catalogue without a notice.
ADAMAS
〒959-2477
1117-384, Shimokonakayama, Shibata-shi, Niigata
TEL. 0254-33-2211
FAX. 0254-33-3756
Production, sale of the Diamond whetstone
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